Sn99/Ag0.3/Cu0.7 Solder Paste, 5ML Syringe No-Clean Lead-Free Soldering Paste, 217°C Melting Point High-Temperature Solder Paste,Solder Paste for Electronics
Product details
| Management number | 219036217 | Release Date | 2026/05/03 | List Price | $4.80 | Model Number | 219036217 | ||
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| Category | |||||||||
- Composition of Solder Paste: Sn: 99% / Ag: 0.3% / Cu: 0.7%, Sloder Flux Content: 11.2%.
- Lead-Free Solder Paste Gross Weight: 0.57 oz / 16 g (Syringe).
- High-Temperature Soldering Paste, Melting Point: 217°C (423°F).
- Syringe Solder Paste Flux Properties: Lead-Free / Smooth & Even Solder Joints / No Solder Balls or Bridging After Reflow.
- Solder Pasteing Applications: Welding of Heat Sink Modules & LED Soldering & High-Frequency Soldering & PCB BGA CPU SMD SMT Electronic Device Rework Tools.
- Warranty: If You Have Any Questions, Please Feel Free to Contact Us at Any Time. Thank You.
| Style | 1 Pack-5CC |
|---|---|
| Material | Tin |
| Item Weight | 0.705 ounces |
| Manufacturer | KELLYSHUN |
| Power Source | hand_powered |
| Item model number | TH-1551 5ML-1 Pack |
| Batteries Included | No |
| Batteries Required | No |
| Product Dimensions | 5 x 1 x 1 inches |
| Included Components | Needles*3, Push Rod*1, Solder Paste*1 |
| Item Package Quantity | 1 |
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