Akasa Thermal Compound T6 ProGrade Max, Thermal Paste Heatsink for CPU/GPU/All Coolers, Non-curing & Non-electrically Conductive, Long Durability, Including Spreader & Wipes, AK-T695-4G

Experience ultra-performing thermal paste designed to optimize heat transmission to your CPU or GPU, ensuring superior cooling efficiency and delivering exceptional thermal conductivity for maximum performance. Specification- Application: Thermally conductive compound / Thermal Conductivity: 14.8 W/mK / Specific Gravity: 2.8 / Form: Non-curing compound / Operating Temperature: -50°C to 280°C / Thermal Impedance: <0.613 (°C-cm²/W) @ 60 psi / Colour: Grey / Viscosity: 95,000 (mPa.s) / Capacity: 4g / Product Code: AK-T695-4G

• [Ultra-High Thermal Conductivity] - Delivers top-tier heat transfer with conductivity up to 14.8 W/mK—ideal for demanding systems.
• [Safe & Non-Conductive] - Non-electrically conductive formula protects components from short circuits and electrical interference.
• [Non-Curing Formula] - No waiting required—enjoy immediate peak cooling performance without setup delays.
• [Easy Application Kit] - Includes 2 cleaning wipes and a spreader for clean, precise, and hassle-free application.
• [Reliable Under Load] - Proven performance in high-load conditions, keeping temperatures lower for optimal system stability.